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Phosphorized Copper Anodes
Product Overview
Phosphorized Copper Anodes supplied by R V Metal Corporation are manufactured from high-purity electrolytic copper with controlled phosphorus content, specifically engineered for stable and efficient electroplating operations. The addition of phosphorus acts as an effective deoxidizer, ensuring uniform anode dissolution, reduced sludge formation, and consistent copper ion replenishment in plating baths. These anodes are widely used in acid copper plating systems where dimensional stability, predictable dissolution behavior, and high cathode surface quality are critical.
Our phosphorized copper anodes are produced under strict metallurgical control to maintain precise phosphorus levels, typically in the range required for electroplating-grade Cu-P alloys. This ensures excellent electrical conductivity while preventing oxygen-related defects that can adversely affect plating efficiency and deposit quality. The anodes are available in multiple forms including slabs, balls, nuggets, and customized shapes to suit rack, barrel, and high-speed continuous plating systems.
Phosphorized copper anodes from R V Metal Corporation are trusted across PCB manufacturing, decorative and functional electroplating, automotive components, electrical hardware, and industrial surface finishing applications. Their consistent chemical composition, controlled dissolution rate, and compliance with international electroplating standards make them a reliable choice for plating shops, OEMs, and EPC contractors seeking long-term bath stability and superior coating performance.
Technical Specifications
| Parameter | Specification |
|---|---|
| Product Name | Phosphorized Copper Anodes |
| Base Material | High Purity Electrolytic Copper |
| Copper Content (Cu) | ≥ 99.90% |
| Phosphorus Content (P) | 0.02% – 0.06% (Controlled Deoxidized Grade) |
| Oxygen Content | ≤ 0.02% |
| Electrical Conductivity | ≥ 90% IACS |
| Density | 8.89 g/cm³ |
| Melting Point | Approx. 1083°C |
| Anode Dissolution Behavior | Uniform and Controlled, Low Sludge Formation |
| Sludge Formation | Minimal, Stable Phosphorus Oxide Film Formation |
| Surface Finish | Smooth / As-Cast / Machined (as specified) |
| Available Forms | Slabs, Balls, Nuggets, Bars, Custom Shapes |
| Standard Sizes | Customizable as per plating tank and basket design |
| Compatible Plating Baths | Acid Copper Plating, PCB Copper Plating, Decorative & Functional Plating |
| Operating Current Density | As per bath chemistry and plating line design |
| Manufacturing Process | Controlled Melting, Phosphorus Alloying, Casting & Finishing |
| Quality Control | Chemical Analysis, Dimensional Inspection, Visual & Surface Checks |
| Standards Compliance | ASTM, ISO, DIN, EN (as applicable) |
| Typical Applications | PCB Manufacturing, Electroplating Shops, Automotive & Electrical Components |
Chemical Composition
| Element | Symbol | Composition (% by Weight) | Purpose / Effect |
|---|---|---|---|
| Copper | Cu | ≥ 99.90% | Primary metal providing electrical conductivity and uniform plating dissolution |
| Phosphorus | P | 0.020 – 0.060% | Acts as a deoxidizer, reduces anode sludge, ensures smooth and controlled dissolution |
| Oxygen | O | ≤ 0.020% | Kept low to prevent anode passivation and oxide inclusions |
| Iron | Fe | ≤ 0.005% | Controlled to avoid contamination of plating bath and rough deposits |
| Nickel | Ni | ≤ 0.002% | Limited to prevent unwanted alloying in plated layers |
| Lead | Pb | ≤ 0.003% | Restricted due to its impact on deposit ductility and environmental compliance |
| Sulfur | S | ≤ 0.002% | Low sulfur minimizes bath instability and deposit brittleness |
| Arsenic | As | ≤ 0.001% | Kept minimal to avoid toxic contamination and plating defects |
| Other Impurities | — | ≤ 0.01% (Total) | Total trace elements controlled within electroplating-grade limits |
UNS Codes & Grades
| UNS Code | Grade / Designation | Copper Content | Phosphorus Content | Standard Reference | Typical Application |
|---|---|---|---|---|---|
| C12200 | Phosphorized Copper (DHP) | ≥ 99.90% | 0.020 – 0.040% | ASTM B187 / ASTM B152 | General electroplating anodes, acid copper baths, industrial plating |
| C12300 | High-Phosphorus Copper | ≥ 99.85% | 0.040 – 0.060% | ASTM B187 (Special) | High-dissolution-rate anodes, heavy-duty electroplating operations |
| C12000 | Phosphorus-Deoxidized Copper (Low P) | ≥ 99.90% | 0.004 – 0.012% | ASTM B187 | Limited plating use where low phosphorus is specified |
| — | Electroplating Grade Phosphorized Copper Anode | ≥ 99.90% | Custom-controlled (0.025 – 0.055%) | OEM / Plating Bath Specification | PCB plating, electronics, decorative & functional copper plating |
Mechanical, Physical & Fabrication Properties
| Property Category | Property | Typical Value / Range | Test Standard | Relevance in Electroplating |
|---|---|---|---|---|
| Mechanical Properties | Tensile Strength | 200 – 250 MPa | ASTM E8 | Ensures structural integrity during handling and basket loading |
| Yield Strength | 70 – 100 MPa | ASTM E8 | Prevents deformation during prolonged anode immersion | |
| Elongation | 30 – 45% | ASTM E8 | Indicates ductility; reduces cracking during casting and machining | |
| Hardness | HB 45 – 65 | ASTM E18 | Optimized for uniform dissolution without excessive sludge | |
| Physical Properties | Density | 8.93 g/cm³ | ASTM B311 | Used for anode weight calculation and bath loading |
| Electrical Conductivity | 85 – 90 % IACS | ASTM B193 | Lower than ETP copper but ideal for controlled anode dissolution | |
| Melting Point | 1080 – 1083 °C | — | Suitable for continuous casting of anode shapes | |
| Thermal Conductivity | 330 – 350 W/m·K | ASTM E1225 | Ensures stable temperature behavior in plating baths | |
| Coefficient of Expansion | 16.5 × 10⁻⁶ /°C | ASTM E228 | Minimizes stress cracking during thermal cycling | |
| Fabrication Properties | Castability | Excellent | Industry Practice | Produces dense, uniform anode structures |
| Machinability | Good | ISO 3685 | Allows precise anode sizing and drilling | |
| Weldability | Limited (Not Recommended) | — | Phosphorus reduces weld quality; mechanical joining preferred | |
| Dissolution Behavior | Uniform, Sludge-Controlled | Plating Bath Dependent | Critical for stable copper ion replenishment in acid baths |
Common Names & International Identifiers
| Region / Standard Body | Common Name | Grade / Designation | UNS Code | Description / Industry Usage |
|---|---|---|---|---|
| United States (ASTM) | Phosphorized Copper Anode | Phosphorized Copper | C12200 | Most widely used anode for acid copper electroplating and PCB manufacturing |
| Europe (EN) | Cu-DHP Anode | EN CW024A | CW024A | European equivalent used in high-purity plating applications |
| International (ISO) | Deoxidized High Phosphorus Copper | Cu-DHP | C12200 | Standardized global grade for controlled anode dissolution |
| Japan (JIS) | Phosphorus Deoxidized Copper | C1220 | C1220 | Used in electroplating, electronics and PCB industries |
| India (IS) | Phosphorus Deoxidized Copper Anode | IS 191 | — | Indian standard reference for phosphorized copper products |
| China (GB) | Phosphorized Copper | TP2 | — | Commonly used in electroplating and heat transfer industries |
| Electroplating Industry | Low-Phosphorus Copper Anode | 0.02–0.04% P | C12200 | Optimized for low-sludge, uniform copper ion replenishment |
| PCB Manufacturing | PCB-Grade Copper Anode | High-Purity Cu-DHP | C12200 | Ensures fine-grain deposits and stable bath chemistry |
Standards & International Equivalents
| Country / Region | Standard | Grade / Designation | UNS / Equivalent Code | Typical Phosphorus Content | Application Reference |
|---|---|---|---|---|---|
| USA | ASTM B187 / ASTM B152 | Phosphorized Copper | C12200 | 0.015 – 0.040% | Electroplating anodes, PCB manufacturing, acid copper baths |
| Europe | EN 1976 / EN 1652 | Cu-DHP | CW024A | 0.015 – 0.040% | Electroplating, electronics, industrial copper anodes |
| International | ISO 431 | Cu-DHP | C12200 | 0.015 – 0.040% | Global standard for phosphorized copper products |
| Japan | JIS H3300 | C1220 | C1220 | 0.015 – 0.040% | Electroplating anodes, electronic components |
| India | IS 191 / IS 410 | Phosphorus Deoxidized Copper | — | 0.015 – 0.040% | Electroplating, industrial copper anodes |
| Germany (DIN) | DIN EN 1652 | Cu-DHP | CW024A | 0.015 – 0.040% | High-purity copper anodes for plating |
| China | GB/T 5231 | TP2 | — | 0.015 – 0.040% | Electroplating, chemical and industrial applications |
| Electroplating Industry | Industry Specification | Low-Phosphorus Copper Anode | C12200 | 0.020 – 0.030% (optimized) | Low sludge formation, stable anode dissolution |
| PCB Manufacturing | OEM / IPC Reference | PCB-Grade Cu-DHP | C12200 | Controlled (≤0.03%) | Fine-line plating, uniform copper deposition |
Applications
| Industry / Sector | Application Area | Role of Phosphorized Copper Anode | Why Phosphorized Copper (Cu-DHP) is Used | Typical End Users |
|---|---|---|---|---|
| Electroplating Industry | Acid Copper Electroplating | Primary soluble anode material | Controlled phosphorus ensures uniform dissolution and minimal sludge formation | Job platers, decorative plating units |
| Printed Circuit Boards (PCB) | Through-hole & surface copper deposition | Maintains stable copper ion concentration in plating bath | Low oxygen content prevents anode passivation and bath contamination | PCB manufacturers, EMS companies |
| Electronics Manufacturing | Fine-line & high-density circuitry plating | Ensures consistent copper thickness and adhesion | Phosphorus improves anode efficiency and plating uniformity | Semiconductor & electronics OEMs |
| Automotive Components | Electroplating of connectors & terminals | Provides high-purity copper deposition | Reduces particulate contamination affecting electrical performance | Auto component manufacturers |
| Electrical & Power Equipment | Plating of busbars, contacts & switchgear parts | Improves conductivity and corrosion resistance | Stable anode behavior under continuous plating cycles | Switchgear & transformer manufacturers |
| Telecommunications | Plating of connectors & RF components | Ensures low-resistance copper layers | High-purity Cu-DHP minimizes signal loss | Telecom equipment OEMs |
| Industrial Hardware | Fasteners, fittings & mechanical parts plating | Decorative and functional copper coating | Smooth, defect-free copper deposits | Industrial hardware manufacturers |
| Surface Engineering | Undercoat for nickel & chromium plating | Acts as an intermediate conductive layer | Excellent adhesion and leveling properties | Surface treatment & coating plants |
| Marine & Offshore | Anti-corrosion copper coatings | Base copper layer for protective systems | High purity ensures consistent corrosion protection | Marine equipment suppliers |
| Research & Development | Electrochemical testing & pilot plating lines | Reference-grade copper source | Predictable anode dissolution characteristics | R&D labs, testing facilities |
Standard Phosphorized Copper Anodes Dimensional Chart
| Phosphorized Copper Anodes – Standard Dimensional Chart (R V Metal Corporation) | |||||||
|---|---|---|---|---|---|---|---|
| Anode Form | Type | Thickness (mm) | Width (mm) | Length (mm) | Finish / Edge | Typical Use | Supply Condition |
| Plate / Slab | Rectangular | 10, 12, 15, 20, 25 | 50, 75, 100, 150, 200 | 300, 450, 600, 900, 1000 | Deburred / squared | General acid copper plating | As-cast / machined |
| Plate / Slab | Custom cut | 6 – 30 | 25 – 300 | 100 – 1200 | Deburred / chamfered | OEM plating tanks, retrofits | Cut-to-size |
| Ball | Solid copper ball | Dia: 25, 38, 50, 63, 75 mm | Round | Phosphor copper baskets / anode bags | Loose packed / bagged | ||
| Nugget / Piece | Irregular pieces | 10–50 mm equivalent size | Clean broken | Anode baskets, top-up | Loose packed | ||
| Shot / Granules | Granulated | 2–8 mm | Granular | Small baskets / fast dissolution | 25 kg bags / drums | ||
| Bar | Flat bar | 10 – 25 | 20 – 100 | 300 – 1200 | Straightened | Hanging anode systems | Cut lengths |
| Hooked Anode | With hanger | 10 – 20 | 50 – 150 | 300 – 1000 | Hanger welded/brazed | Direct tank hanging | Ready-to-use assembly |
| Anode Basket Fill | Ball / Nugget mix | As per basket spec | — | High-efficiency plating lines | Supply matched to basket | ||
Notes: Sizes listed are common industry supply ranges. Actual anode dimensions should be selected based on plating tank geometry, anode bag/basket compatibility, current density requirements, and consumption rate. Custom sizes and hanger formats can be supplied on request.
